The Phase and Morphology of CuInSe2 Film Prepared by One-Step electrodeposition
نویسندگان
چکیده
منابع مشابه
ONE STEP ELECTRODEPOSITION OF CuInSe2 THIN FILMS
Formation of CuInSe2 (CIS) thin films from aqueous solution containing citrate as complexing agent is reported. The surface morphology and the composition of the deposited films are characterized by scanning electron microscopy (SEM). The texture of the deposits and their compositions are analyzed by X-ray diffraction and transmission electron microscopy (TEM). Annealing of the films at 350°C i...
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Two different dual phase steels were prepared from low carbon manganese steel after the elimination of the banding using the direct quenching (DQ) and the step quenching (SQ) procedures. Different heat treatments resulted in different martensite morphologies, microstructures and mechanical properties. The heat treatments were designed in such a way to obtain a 0.25 volume fraction of martensite...
متن کاملCyclic Voltammetry Investigation of the Mechanism of CuInSe2 and CuIn(Al)Se2 Electrodeposition from Aqueous Solution
Electrodeposition of CuInSe2 (CIS) and CuInAlSe2 (CIAS) from aqueous solution has been systematically investigated by cyclic voltammetery implementing different scan rates. It has been shown that electrodeposited CIS and CIAS have been formed on the substrate through electrochemical-chemical interaction of reduces species on the substrate. From the obtained results, it could be inferred that I...
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15 صفحه اولTemplate electrodeposition of single-phase p- and n-type copper indium diselenide (CuInSe2) nanowire arrays.
CuInSe(2) nanowire arrays were fabricated by electrodeposition from aqueous solutions of copper sulfate, indium sulfate, selenium dioxide, and citric acid, using anodic alumina membranes as templates. X-ray diffraction patterns showed that the wires were single phase (chalcopyrite structure) but polycrystalline, and a band gap of ∼1 eV was obtained from optical measurements. TEM and SEM confirm...
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ژورنال
عنوان ژورنال: Materials Science
سال: 2017
ISSN: 2029-7289,1392-1320
DOI: 10.5755/j01.ms.23.4.17447